| 摘要 |
PROBLEM TO BE SOLVED: To easily and reliably stick a DAF by adhering the DAF to the back of a wafer, where the back is machined in a recessed shape. SOLUTION: A viscous film sticking device comprises a wafer holder 31 for holding a wafer W; a DAF holder 32 for holding a DAF 36; a decompression chamber 33 that stores the wafer holder 31 and the DAF holder 32, forms a space E surrounded by a chuck table 34 in the wafer holder 31 and a chuck table 35 in the DAF holder 32, and decompresses the space E; and a control unit 30c that brings a back corresponding to the device region of the wafer W held by the wafer holder 31 closer to the DAF 36 held by the DAF holder 32 in the decompressor chamber 33, decompresses the space E between the wafer W and the DAF 36 for pressing, and sticks the DAF 36 to the back corresponding to the device region of the wafer W. COPYRIGHT: (C)2007,JPO&INPIT |
