发明名称 LASER SOLDERING METHOD AND LASER SOLDERING DEVICE
摘要 PROBLEM TO BE SOLVED: To carry out soldering for a short time, as well as suppressing the cost increase of a soldering device. SOLUTION: When soldering a battery contact piece 46 to a printed circuit board 41, soldering is carried out after heating the battery contact piece 46 with big calorific capacity by a ceramic heater 67, and heating a land 54 formed on the printed circuit board 41 by a laser light L1 irradiated from a laser device 63. By this way at the time of introduction, cost increase is suppressed by heating the battery contact piece for a short time up to the melting temperature, and also by utilizing a comparatively inexpensive laser device of low output power. Since the time required for soldering is shortened, the productivity of a printed circuit board is also increased. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007073661(A) 申请公布日期 2007.03.22
申请号 JP20050257513 申请日期 2005.09.06
申请人 FUJIFILM CORP 发明人 ITAKURA KAZUO
分类号 H05K3/34;B23K1/00;B23K1/005;B23K101/42 主分类号 H05K3/34
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