| 摘要 |
PROBLEM TO BE SOLVED: To provide a two-layered totally thin flexible substrate which keep (1) initial adhesion force, (2) heat-resistant adhesion force after the leaving in 150°C of atmospheric air for 168 hours, (3) PCT adhesion force after PCT testing (Pressure Cooker Test) that is the leaving under the environment of 121°C, 95% of humidity, and two atmospheric pressures for 100 hours all above 400 N/m in a manufacturing of a flexible wiring plate using an aromatic polyamide film, and to provide a manufacturing method therefor. SOLUTION: This two-layered flexible substrate comprises an underlayer metal layer directly formed on at least one side of the aromatic polyamide film not through an adhesive; and subsequently a copper coat layer formed on the underlayer metal layer, wherein a modifying layer of 2-15 nm thickness is prepared on a front surface of the aromatic polyamide film with which the underlayer metal layer touches by a dry type surface treatment method. In addition, an underlayer metal layer containing a nickel-chromium-molybdenum alloy is formed on a front surface of the modified film. COPYRIGHT: (C)2007,JPO&INPIT |
