| 摘要 |
PROBLEM TO BE SOLVED: To provide a low cost polishing pad which flattens the surface of a workpiece with a high polishing rate without causing a scratch on the surface. SOLUTION: The polishing pad comprises a resin sheet 11 having a flat surface, and abrasive grains 12 which are dispersed and fixed in the inner part and on the surface of the resin sheet 11. The tensile strength of the polishing pad 10 is in the range of 30 MPa or higher to 70 MPa or lower, and preferably in the range of 40 MPa or higher to 60 MPa or lower. The tensile break elongation of the polishing pad 10 is in the region of 50% or lower, preferably in the region of 20% or lower, and more preferably in the region of 5% or lower. The average grain size of primary grain sizes of the abrasive grains 12 is in the range of 0.005μm or higher to lower than 0.5μm, and preferably in the range of 0.005μm or higher to 0.2μm or lower. The content of the abrasive grain fixed to the resin sheet 11 is in the range of 10 to 50 volume% or, and preferably in the range of 10 volume% or higher to 24 volume% or lower. COPYRIGHT: (C)2007,JPO&INPIT
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