发明名称 WIRING BOARD, MANUFACTURING METHOD THEREFOR, ELECTRO-OPTIC DEVICE, AND ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To align a columnar structure body which is utilized as a conductor and a semiconductor in a desired place on a wiring board by a simple method. SOLUTION: A trench 103 is formed to the surface of a glass board 101 with a foundation insulating film 102 formed on a surface, and a carbon nano-tube in which a solvent is dispersed from the upper section of the trench 103 is made to flow, and the carbon nano-tube is arranged in the trench 103. The solvent in the trench 103 is removed, only the carbon nano-tube is left in the trench 103, and source-drain regions 104 are formed so as to be brought into contact with the left carbon nano-tube. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007073706(A) 申请公布日期 2007.03.22
申请号 JP20050258316 申请日期 2005.09.06
申请人 SEIKO EPSON CORP 发明人 YUDASAKA KAZUO
分类号 H01L21/336;G02F1/1368;H01L29/786;H01L51/50 主分类号 H01L21/336
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