| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for manufacturing a semiconductor, capable of shortening a lead time by efficiently removing a film formed on a susceptor. SOLUTION: The manufacturing device comprises: a film forming chamber 2 in which a susceptor 3 for holding a wafer 1 is installed for introducing a film forming gas to form a film; an etching chamber 4 that removes the film formed at the susceptor 3 at film forming; and a storage 5 that temporarily stores the susceptor 3 whose film has been removed. Thus, the film formed on the susceptor 3 is efficiently removed to shorten a lead time. COPYRIGHT: (C)2007,JPO&INPIT
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