AIRTIGHT SEALING PACKAGE AND OPTICAL SUBMODULE

摘要

PROBLEM TO BE SOLVED: To provide an airtight sealing package and an optical submodule which are microminiaturized for an optical semiconductor element at low cost without requiring a complex process. SOLUTION: The airtight sealing package comprises: a flat substrate 11 consisting of a material having a non-moisture-permeability; a cap 14 comprising a material having the non-moisture-permeability and a protruded part 15 formed so as to surround the predetermined region on the mounting surface; an oxide film 12 formed on the surface of the convex part 15; and the oxide film 12 formed in a region contacting with the oxide film 12 of the cap 14 on the mounting surface of the substrate 11 at the time of mounting the cap 14 and the substrate 11. Bonding the substrate 11 to the cap 14 with a low melting glass 13 at the time of mounting, forms a space with airtight sealed. COPYRIGHT: (C)2007,JPO&INPIT