| 摘要 |
A heat spreader ( 20 ) is added to a package to enhance thermal and advantageously electrical performance. In manufacture, a heat spreader precursor ( 24 ) is advantageously placed over a group of dies and secured after bonding (e.g., wire or tape bonding or flip-chip bonding) and before matrix/block mold. For example, a package strip ( 10 ) may consist of a row (linear array) of groups of die attach areas (e.g. in a rectangular array of four). The heat spreader precursor ( 20 ) may accommodate one such group or multiple groups along the package strip ( 10 ). The package strip ( 10 ) may then be singulated to form the individual packages. Each singulated package includes a die ( 14 ), its associated substrate 16 (e.g., either a lead frame or interposer type substrate) and a portion of the heat spreader precursor ( 24 ) as a heat spreader ( 20 ).
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