| 摘要 |
<p>An objective of this invention is to provide an epoxy resin composition for encapsulating a semiconductor chip, which is excellent in flowability and moldability without deterioration in crack resistance during soldering and flame retardance. Specifically, this invention provides a resin composition for encapsulating a semiconductor chip comprises an epoxy resin (A) containing the specific structure; a phenolic resin (B) containing the specific structure; an inorganic filler (C); a curing accelerator (D); a silane coupling agent (E); and Compound (F) containing an aromatic ring in which at least two adjacent carbon atoms of the ring member carbon atoms are coupled to a hydroxyl group, respectively.</p> |
