发明名称 COOLING DEVICE FOR COOLING ELECTRONIC COMPONENTS, AS WELL AS ELECTRONIC CONSUMER APPLIANCE EQUIPPED WITH SUCH DEVICE
摘要 The invention relates to a cooling device (5, 105) for cooling electronic components (4, 104), and an electronic consumer appliance (1, 101) equipped with such cooling device (5, 105). The cooling device (5, 105) is made of thermally conductive material and comprises at least one first leg (11, 111), designed to abut the electronic components (4, 104) and at least one second leg (12, 112), which is hinged or slidably coupled to a first leg (11, 111), so as to enable such second leg (12, 112) to be brought into abutting contact with an adjacent body with good heat dissipating properties such as a housing (2, 102) of the appliance (1, 101), thereby establishing a thermally conductive bridge. Biasing means (14, 114) may be provided to bias the second leg (12, 112) into abutting engagement with the heat dissipating body.
申请公布号 WO2007031926(A2) 申请公布日期 2007.03.22
申请号 WO2006IB53199 申请日期 2006.09.11
申请人 KONINKLIJKE PHILIPS ELECTRONICS N.V.;TIEKINK, DERK 发明人 TIEKINK, DERK
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
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