发明名称 |
Cleaning composition for semiconductor components and process for manufacturing semiconductor device |
摘要 |
<p>A cleaning composition for semiconductor components comprises a water-soluble polymer (a) having a specific molecular weight and a compound (b) represented by the following formula (1): NR4OH wherein each R is independently a hydrogen atom or an alkyl group of 1 to 6 carbon atoms. <??>A process for manufacturing a semiconductor device comprises chemical mechanical polishing a semiconductor component, and cleaning the semiconductor component with the cleaning composition for semiconductor components. <??>The cleaning composition exerts a high cleaning effect on impurities remaining on a polished surface of a semiconductor component after chemical mechanical polishing, and becomes little burden on the environment.</p> |
申请公布号 |
EP1609847(B1) |
申请公布日期 |
2007.03.21 |
申请号 |
EP20050013619 |
申请日期 |
2005.06.23 |
申请人 |
JSR CORPORATION |
发明人 |
HATTORI, MASAYUKI;NAMIE, YUJI;KAWAHASHI, NOBUO |
分类号 |
C11D11/00;C03C15/00;C09K13/00;C11D7/06;C11D7/22;C11D7/32;C11D7/34;C23F1/00;H01L21/02;H01L21/306 |
主分类号 |
C11D11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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