发明名称 |
Production method and device for improving the bonding between plastic and metal |
摘要 |
<p>A semiconductor having a leadframe is disclosed. In one embodiment, a leadframe is disclosed to be fitted with a semiconductor chip and is to be encapsulated with a plastic compound has a metallic single-piece base body, to which an interlayer is applied. The interlayer has a surface including a matrix of islands of remaining material of substantially uniform height, with voids extending between said islands.</p> |
申请公布号 |
EP1673800(B1) |
申请公布日期 |
2007.03.21 |
申请号 |
EP20040789914 |
申请日期 |
2004.10.01 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
BETZ, BERND;DANGELMAIER, JOCHEN;PAULUS, STEFAN |
分类号 |
H01L21/00;H01L21/48;H01L23/495 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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