Alignment mark of exposing equipment and measuring method for semiconductor manufacturing

摘要

An alignment mark of exposure equipment and a measuring method for a semiconductor manufacturing are provided to prevent an alignment failure in a photolithographic process and to improve the yield by monitoring easily an alignment pattern of an exposed pattern on a bare wafer using an improved corner mark arranged at each corner of field. A corner mark is composed of four sub marks. The four sub marks are arranged like a square type structure. The corner mark is arranged at each out of four corner portions of field. A dark pattern or a clear pattern of the sub mark is formed like a square type structure.