| 摘要 |
Coated wafer level camera modules and associated methods are disclosed. One aspect of the invention is directed toward a wafer level camera module that includes a die having multiple image sensor integrated circuits. The module can further include a coating covering at least a portion of the die. The coating can be configured to provide at least a partial shield against selected types of electromagnetic energy. The module can still further include multiple contacts positioned to electrically couple the integrated circuits to a support. In certain embodiments, the selected types of electromagnetic energy can include one or more selected frequencies of light. |
