| 发明名称 |
Semiconductor device and fabrication process therefor |
| 摘要 |
A semiconductor device which includes: a semiconductor chip bonded to a surface of a solid device; and a stiffener surrounding the periphery of the semiconductor chip. A surface of the stiffener opposite from the solid device is generally flush with a surface of the semiconductor chip opposite from the solid device.
|
| 申请公布号 |
US7192870(B2) |
申请公布日期 |
2007.03.20 |
| 申请号 |
US20050122052 |
申请日期 |
2005.05.05 |
| 申请人 |
ROHM CO., LTD. |
发明人 |
SHIBATA KAZUTAKA;OKA JUNJI;KASUYA YASUMASA |
| 分类号 |
H01L21/302;H01L23/12;B05B12/14;B05B15/12;H01L21/461;H01L21/56;H01L21/60;H01L23/16;H01L23/31;H01L23/36;H01L23/48 |
主分类号 |
H01L21/302 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
