发明名称 Positive resist composition and method of forming resist pattern using the same.
摘要 A positive resist composition comprising: (A) a fluorine atom-containing resin, wherein the resin comprises at least one group that increases a solubility of the resin in an alkali developer by the action of an acid; and (B) a sulfonium salt compound having a cation moiety, wherein the cation moiety contains at least one hydroxy group, and the sulfonium salt compound generates an acid upon irradiation with one of an actinic ray and a radiation.
申请公布号 US7192685(B2) 申请公布日期 2007.03.20
申请号 US20040806451 申请日期 2004.03.23
申请人 FUJI PHOTO FILM CO., LTD. 发明人 KODAMA KUNIHIKO
分类号 G03F7/004;C08F2/50;G03F7/039;H01L21/027 主分类号 G03F7/004
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