| 摘要 |
The present invention is a method of fabricating a semiconductor device by transferring a semiconductor chip supported on a flexible support film to a mount member by means of a robot arm. This method comprises a film bending step of bending a support film so that same has a pickup face that lies along the movement direction of the robot arm and a withdrawal face that lies substantially perpendicular to this movement direction and does not interfere with the robot arm; a step of disposing the mount member, whereon the semiconductor chip is to be mounted, in a position facing the withdrawal face and flanking on the pickup face; and a step of picking up the semiconductor chip from the pickup face by means of the robot arm and transferring the semiconductor chip to the mount member.
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