发明名称 |
Fingerprint sensor apparatus and manufacturing method thereof |
摘要 |
A fingerprint sensor apparatus can provide a normal fingerprint sensor function even when a mold flash is formed. The fingerprint sensor apparatus recognizes a pattern of a fingerprint by being contacted by a finger. A semiconductor chip has a surface on which a sensor part is formed. The semiconductor chip is encapsulated by a seal resin. The sensor part is exposed in a bottom of an opening formed in the seal resin part. A distance between an edge of the bottom of the opening and an edge of the sensor part is 0.3 mm to 0.1 mm.
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申请公布号 |
US7192798(B2) |
申请公布日期 |
2007.03.20 |
申请号 |
US20020289268 |
申请日期 |
2002.11.07 |
申请人 |
FUJITSU LIMITED |
发明人 |
OKADA AKIRA;SAKODA HIDEHARU;HAYAKAWA MICHIO;TANIGUCHI FUMIHIKO |
分类号 |
G01B7/28;H01L21/00;A61B5/117;G06K9/00;G06T1/00;H01L21/56 |
主分类号 |
G01B7/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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