METHOD FOR APPLYING SOLDER ONTO METALLIC STRUCTURE WITH USE OF VIBRATION AND APPARATUS FOR PERFORMING THE SAME

摘要

FIELD: manufacture of honeycomb members. ^ SUBSTANCE: metallic structure in the form of honeycomb member including at least partially structured or profiled foil sheets and having ducts with wedge shaped cavities formed in them is brought in contact with powder solder. Metallic structure at least during its contact with solder is subjected to vibration by means of vibrator and part of solder stuck to it remains in such state while metallic structure is hold by means of clamping member and (or) arm of manipulator and subjected to vibration. By action of vibration solder is collected, mainly in said wedge-shaped cavities. Solder in reservoir also may be subjected to vibration by means of vibrator or impulse generator. ^ EFFECT: possibility for providing zones uniformly coated with solder and having strict boundaries relative other parts of metallic structure, lowered consumption of solder, increased useful life period of soldered joint at high thermal and dynamic loads. ^ 14 cl, 6 dwg