发明名称 Methods of forming capacitor structures
摘要 The invention includes a method of forming a capacitor structure. A first electrical node is formed, and a layer of metallic aluminum is formed over the first electrical node. Subsequently, an entirety of the metallic aluminum within the layer is transformed into one or more of AlN, AlON, and AlO, with the transformed layer being a dielectric material over the first electrical node. A second electrical node is then formed over the dielectric material. The first electrical node, second electrical node and dielectric material together define at least a portion of the capacitor structure. The invention also pertains to a capacitor structure which includes a first electrical node, a second electrical node, and a dielectric material between the first and second electrical nodes. The dielectric material consists essentially of aluminum, oxygen and nitrogen.
申请公布号 US7192827(B2) 申请公布日期 2007.03.20
申请号 US20010755673 申请日期 2001.01.05
申请人 MICRON TECHNOLOGY, INC. 发明人 FORBES LEONARD;AHN KIE Y.;ELDRIDGE JEROME MICHAEL
分类号 H01L21/8242;H01L21/02;H01L21/314;H01L21/316;H01L21/318 主分类号 H01L21/8242
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