| 发明名称 |
IC package, inspection method of IC package mounting body, repairing method of IC package mounting body, and inspection pin for IC package mounting body |
| 摘要 |
Disclosed is an IC package including an interpose substrate and lands for external connection disposed on a face of the interpose substrate in a grid pattern, the interpose substrate having a penetration hole on at least a position between the lands for external connection disposed in a grid pattern. Besides, there are disclosed an inspection method of an IC package mounting body mounting this IC package, a repairing method of an IC package mounting body mounting this IC package, and an inspection pin for an IC package mounting body used for such an inspection.
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| 申请公布号 |
US7193321(B2) |
申请公布日期 |
2007.03.20 |
| 申请号 |
US20040940963 |
申请日期 |
2004.09.15 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
OGAWA HIDEKI;TANAKA HIDENORI |
| 分类号 |
H01L23/12;H01L23/48;H01L21/48;H01L21/66;H01L23/13;H01L23/498;H05K3/22;H05K3/34 |
主分类号 |
H01L23/12 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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