发明名称 Supporting frame for surface-mount diode package
摘要 A supporting frame is used to solidly bridge to the two metallic contacts of a surface mount diode chip. Any bending or twisting stress between the two contacts is borne by the supporting frame instead of the diode chip. Otherwise the stress may damage the diode chip. wherein said supporting forms a cantilever over said first metallic contact and the overhanging end of the cantilever is glued to said second metallic contact.
申请公布号 US7193303(B2) 申请公布日期 2007.03.20
申请号 US20050199925 申请日期 2005.08.10
申请人 发明人
分类号 H01L23/02;H01L23/495;H01L33/00;H01L33/48 主分类号 H01L23/02
代理机构 代理人
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