发明名称 |
INTERCONNECTING SUBSTRATES FOR MICROELECTRONIC DIES, METHODS FOR FORMING VIAS IN SUCH SUBSTRATES, AND METHODS FOR PACKAGING MICROELECTRONIC DEVICES |
摘要 |
<p>Substrates for mounting microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices are disclosed herein. A method of manufacturing a substrate in accordance with one embodiment of the invention includes forming a conductive trace on a first side of a sheet of non-conductive material, and forming a via through the non-conductive material from a second side of the sheet to the conductive trace. The method further includes removing a section of the non-conductive material to form an edge of the non-conductive material extending across at least a portion of the via. In one embodiment, forming the edge across the via exposes at least a portion of the second conductive trace for subsequent attachment to a terminal on a microelectronic die.</p> |
申请公布号 |
SG130074(A1) |
申请公布日期 |
2007.03.20 |
申请号 |
SG20050056189 |
申请日期 |
2005.09.01 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
CHONG, CHIN HUI;LEE, CHOON KUAN;CORISIS, DAVID J. |
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