发明名称 Method of wafer/substrate bonding
摘要 A method of bonding two components by depositing an amorphous and non-hydrogenated intermediate layer ( 2 ) on one of the components ( 1,4 ) and arranging the components ( 1,4 ) in spaced relationship with the intermediate layer ( 2 ) therebetween. The method further comprises heating one or both of the components ( 1,4 ) before bringing the components ( 1,4 ) into contact. Finally, a voltage is applied to the components ( 1,4 ) to create a permanent bond between the two components.
申请公布号 US7192841(B2) 申请公布日期 2007.03.20
申请号 US20040512711 申请日期 2004.10.27
申请人 AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH 发明人 WEI JUN;WANG ZHIPING;XIE HONG
分类号 H01L21/46;C03C27/04;C04B37/00;C04B37/04;H01L21/30;H01L21/58;H01L21/76 主分类号 H01L21/46
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