发明名称 |
Method for fabricating a memory cell |
摘要 |
Silicon nanocrystals are applied as storage layer ( 6 ) and removed using spacer elements ( 11 ) laterally with respect to the gate electrode ( 5 ). By means of an implantation of dopant, source/drain regions ( 2 ) are fabricated in a self-aligned manner with respect to the storage layer ( 6 ). The portions of the storage layer ( 6 ) are interrupted by the gate electrode ( 5 ) and the gate dielectric ( 4 ), so that a central portion of the channel region ( 3 ) is not covered by the storage layer ( 6 ). This memory cell is suitable as a multi-bit flash memory cell in a virtual ground architecture.
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申请公布号 |
US7192830(B2) |
申请公布日期 |
2007.03.20 |
申请号 |
US20040862818 |
申请日期 |
2004.06.07 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
GOLDBACH MATTHIAS;MIKOLAJICK THOMAS;BIRNER ALBERT |
分类号 |
H01L21/336;H01L21/28;H01L29/423;H01L29/788 |
主分类号 |
H01L21/336 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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