发明名称 Method for manufacturing a semiconductor device
摘要 A method for manufacturing a semiconductor device including forming a gate electrode over a substrate; forming a pate insulating film over the pate electrode and over the substrate; forming a semiconductor film on the gate insulating film; providing the semiconductor film with a metal element; crystallizing the semiconductor film provided with the metal element; doping an element which is used for gettering into a portion of the crystallized semiconductor film; and heating the crystallized semiconductor film whereby the metal element contained in a channel region of the semiconductor film is gettered by the portion.
申请公布号 US7192817(B2) 申请公布日期 2007.03.20
申请号 US20040917359 申请日期 2004.08.13
申请人 发明人
分类号 H01L21/84;H01L21/336;H01L21/77;H01L27/12;H01L29/423;H01L29/49 主分类号 H01L21/84
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