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发明名称
表面构装型半导体装置、及其制造方法
摘要
本发明,系提供一种表面构装型半导体装置,其系将形成于集合基板(装载有发光元件)之阴极配线图案8及阳极配线图案10与集合基板一起切断,以作成将切断面朝向构装基板以作为构装面进行构装时之阳极连接电极12与阴极连接电极15的表面构装型半导体装置1,其中,于阳极连接电极12端部形成有大致半椭圆形之缺口部16,于阴极连接电极15角部形成有大致扇形之缺口部14。藉此,即使于切断集合基板而形成之连接电极产生毛边,亦能藉由确实形成焊料填角,而防止连接不良且确保强度。
申请公布号
TW200711190
申请公布日期
2007.03.16
申请号
TW095129731
申请日期
2006.08.14
申请人
松下电器产业股份有限公司
发明人
草野智之;石桥和博;鬼塚崇彰
分类号
H01L33/00(2006.01)
主分类号
H01L33/00(2006.01)
代理机构
代理人
桂齐恒;阎启泰
主权项
地址
日本
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