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发明名称
光半导体、其封闭材料及封闭用组成物
摘要
光半导体封闭用组成物系提供含有(A)聚有机矽氧烷及(B)相对于聚有机矽氧烷100重量份为100~1,000重量份的脂肪族或脂环族环氧基化合物(C)羧酸酐系硬化剂,或进而含有(D)硬化促进剂。可形成能够罐烧(potting)成形、透明性、UV耐久性、耐热性及回焊试验(solder reflow),或热循环时的耐龟裂优异之光半导体封闭材料之作为光半导体封闭用材料的主体成分等为有用的光半导体封闭用组成物等。
申请公布号
TW200711060
申请公布日期
2007.03.16
申请号
TW095103803
申请日期
2006.02.03
申请人
JSR股份有限公司
发明人
秋池利之
分类号
H01L23/00(2006.01);G03F7/022(2006.01)
主分类号
H01L23/00(2006.01)
代理机构
代理人
林志刚
主权项
地址
日本
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