| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To suppress propagation noise among semiconductor devices at the time of supplying reference voltage by a surface feed method in a semiconductor module wherein a plurality of semiconductor devices are mounted on a module substrate. <P>SOLUTION: The semiconductor module includes a noise transfer suppressing means. The noise transfer suppressing means suppresses noise transfer between a first memory chip 2a and a second memory chip 2b, by adjusting the frequency characteristic of the transfer impedance between a first reference voltage inputting section 10a and a second reference voltage inputting section. The noise transfer suppressing means suppresses noise transfer by lowering the maximum value on the frequency characteristic which appears, when a first antiresonant frequency of a circuit which includes a first reference electrode 20a and a first decoupling capacitor 21a, and a second antiresonant frequency of a circuit which includes a second reference electrode 20b and a second decoupling capacitor 21b, are both predetermined frequencies. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
