| 摘要 |
PROBLEM TO BE SOLVED: To provide a film adhesive for fixing a semiconductor element which, even though it is intended for fixing the semiconductor element, is capable of sufficiently preventing void formation by achieving a thickness thicker than that of an electronic component mounted on a substrate, is capable of sufficiently filling a gap between the substrate and the semiconductor element by virtue of the thickness of the electronic component mounted on the substrate and is capable of efficiently and securely attaching the semiconductor element onto the substrate having a rough surface. SOLUTION: The film adhesive for fixing the semiconductor element has a thickness of 200-2,000 μm and is obtained by stacking a plurality of adhesive films made of a material having melt viscosity at 140°C of ≤50 Pa s. COPYRIGHT: (C)2007,JPO&INPIT |
