发明名称 THROUGH-HOLE FORMING METHOD, AND PIEZOELECTRIC DEVICE MANUFACTURING METHOD AND PIEZOELECTRIC DEVICE MANUFACTURED THEREBY
摘要 In a method of forming a part of a through-hole for a piezoelectric substrate having an excitation electrode and a leading electrode which are formed on a first surface of the piezoelectric substrate and are made of a thin metal film in order to establish a conductivity, the method includes: blasting a position on a second surface of the piezoelectric substrate corresponding to the leading electrode to form a preliminary hole by boring the piezoelectric substrate in its halfway; etching a bottom of the preliminary hole to form a part of a through-hole through which a part of the leading electrode is exposed; and placing a conductive material in the part of a through-hole, the conductive material contacting the leading electrode from a side of the second surface of the piezoelectric substrate.
申请公布号 US2007058003(A1) 申请公布日期 2007.03.15
申请号 US20060470543 申请日期 2006.09.06
申请人 SEIKO EPSON CORPORATION 发明人 AOKI SHINYA
分类号 B41J2/045 主分类号 B41J2/045
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