| 摘要 |
A method and apparatus for providing power to a thin film thermoelectric cooling (TFTEC) device disposed between a heat generating device, such as a semiconductor device, and a cooling device, such as an integrated heat spreader. An electrically conductive pathway may be electrically coupled at one end to the TFTEC and also to an electrically conductive feature on the surface of a substrate at the other end. The electrically conductive pathway itself may be routed and retained in close proximity to the cooling device between the TFTEC and the substrate.
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