SEMICONDUCTOR DEVICE

摘要

A plurality of LSI chips (1) are stacked on an interposer (2). A signal coil (1b) for signal transmission is formed on the circuit formation surface of the LSI chip (1) formed using a Si substrate (1a). The signal coil (1b) is connected to a circuit formed within the LAI chip (1). A through hole (1d) is formed at the center part of the signal coil (1b) on the Si substrate (1a). On the interposer (2), a signal coil (2c) connected through a feedthrough conductor (2d) to a solder ball (5) is formed. At the center parts of the signal coils (1b, 2c), a magnetic pin (3) made of a magnetic material is inserted.