| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting structure of a semiconductor device which can inexpensively and positively seal a semiconductor device mounted on a circuit board, while suppressing thickening of film, and to provide a mounting method thereof. <P>SOLUTION: The mounting method of a semiconductor device 12 is for mounting the semiconductor device 12 on the circuit board 11. The semiconductor device 12 is provided on the circuit board 11, and a first conductive portion 22 of the semiconductor device 12 is electrically connected to a second conductive portion 25 of the circuit board 11 via a wiring 14. A first precursor liquid 16a, that is a precursor of a first resin 16, is disposed on at least one part of the circuit board 11 used as the periphery of the semiconductor device 12. After that, a second precursor liquid 15a used as a precursor of a second resin 15 and having a viscosity lower than that of the first precursor liquid 16a is disposed between the semiconductor device 12 and the first precursor liquid 16a so that the semiconductor device 12 and the wiring 14 are covered. Then, by making the first and second precursor liquids 16a and 15a are collectively cured, the first and second resins 16 and 15 are formed. <P>COPYRIGHT: (C)2007,JPO&INPIT |
