发明名称 SURFACE-MOUNTED COMPONENT MOUNTING APPARATUS, AND METHOD FOR CORRECTING FLATNESS OF SURFACE-MOUNTED COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a surface-mounted component mounting apparatus in which flatness of a surface-mounted component on a printed circuit board is detected and if a defective flatness is detected, this can be corrected. <P>SOLUTION: A surface-mounted component mounting apparatus is installed on a mounting head 1 which mounts a surface-mounted component on a printed circuit board, by fitting a fitting projection 20b projected on the surface-mounted component 3 into a fitting hole 4a opened on the printed circuit board 4. The apparatus comprises a height-detecting means 12 for detecting heights of a plurality of measuring points 20c, 20d preset to the surface-mounted component, after mounting the surface-mounted component; a planarity calculation means 10b for calculating the planarity of the surface-mounted component, based on a detection value detected by the height-detecting means; a pressing amount calculating means 10e for calculating the pressing amount of the surface-mounted component required for planarity correction from the flatness obtained by the planarity calculation means; and a correction means for pressing the surface-mounted component into the printed circuit board, according to the pressing amount, calculated by the pressing amount calculation means. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007067343(A) 申请公布日期 2007.03.15
申请号 JP20050255077 申请日期 2005.09.02
申请人 HITACHI COMMUNICATION TECHNOLOGIES LTD 发明人 IZUMI NOBUYASU
分类号 H05K13/04 主分类号 H05K13/04
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