BACKSIDE-GROUND-TYPE FLIP CHIP SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor package which can improve heat dissipation properties by dissipating heat generated by a chip through a backside ground and can enhance electrical properties by forming an electrical ground without generating a parasitic component.

SOLUTION: A backside-ground-type flip chip semiconductor package comprises: a substrate 110; at least one chip 120 which is flip-chip bonded onto the upper surface of the substrate 110 so as to be electrically connected to a circuit pattern-printed on the substrate 110; a molded portion 130 which is formed on the substrate 110 so that a backside ground 125 of the chip 120 is exposed to the outside; and a conductive metal layer 140 which is provided on the outer surface of the molded portion 130 so as to be electrically connected to the backside ground 125.

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