| 摘要 |
PROBLEM TO BE SOLVED: To prevent a printed circuit board from cooling during an electric conduction inspection and also pressurize the printed circuit board to reform flapping and warpage, without having to pressurize a through hole and a via hole in a conduction inspecting device of the printed circuit board, which has the through hole or the via hole, having an inspection jig for inspecting electrical conduction, while keeping the heated printed circuit board warm. SOLUTION: The inspection jig 10 includes an upper jig 20 and a lower jig 30. The jigs 20, 30 have non-through holes 21, 31 at positions, corresponding to the through hole 6 of the print circuit board 4 in the condition of pressurizing to retaining the printed circuit board 4 between the jigs 20, 30. The through hole 6 has a structure for avoiding the pressurization by the jigs 20, 30. COPYRIGHT: (C)2007,JPO&INPIT
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