| 摘要 |
A self-assembled thin film thermoelectric device useful for thermal management of semiconductor devices, for medical treatment, or for other applications where precise, efficient, and controlled heating or cooling may be useful. TEC elements, including n-type TEC elements and p-type TEC elements may be self-assembled to binding sites on a substrate, and alternating TEC element types may be electrically coupled to each other with metallization in a serial circuit arrangement. A substrate suitable for self-assembly of a TFTEC device may include heat generating devices, cooling devices, or thermally neutral devices. Binding sites may be provided or activated so that TEC elements may be attracted to, aligned with, or attached to the binding sites.
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