| 摘要 |
<p>A chip resistor (1) has an insulating substrate (2) constructed in a chip form, a pair of terminal electrodes (3, 4) formed at both ends of the insulating substrate (2), resistor films (5) formed arranged in parallel with each other between the pair of terminal electrodes (3, 4) on the surface of the insulating substrate (2), and a cover coating formed to cover each resistor film (5) on the surface of the insulating substrate (2). In the chip resistor (1), one terminal electrode (3) consists of discrete upper surface electrodes (8) and a side face electrode (9). Each discrete upper surface electrode (8) is formed on the insulating substrate (2) so as to be independently connected to each resistor film (5). The side face electrode (9) is formed on one side face of the insulating substrate (2) so as to be connected to all the discrete upper surface electrodes (8).</p> |
