| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a probing method capable of securing a stable contact between a probe needle and an electrode pad, and of improving stability of inspection. <P>SOLUTION: The probing method is to inspect electric characteristics of a semiconductor chip by making the probe needle contact the electrode pad 1 provided respectively on a single or a plurality of semiconductor chips formed on a semiconductor wafer. In the method, when the electrode pad and the probe needle are made to contact each other plural times, there is changed at least one of a target position 3 where the probe needle is made to contact the electrode pad or of a direction of contact operation of the probe needle to the electrode pad. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
