| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing occurrence of internal peel-off, and chipping damage in a protective film and each wiring layer of a scribe line region by dicing. SOLUTION: A semiconductor device comprises a plurality of semiconductor regions 4 in which a semiconductor circuit is formed, and a scribe line region 3 for separating each semiconductor element region 4. The scribe line region 3 has a border region between the scribe line region 3 and the semiconductor element region 4, a seal is formed in the border region for separating the semiconductor element region 4 and the scribe line region 3, the seal is formed of seal rings 6 and auxiliary portions 7, the seal rings 6 are continuously formed along a border between the semiconductor element region 4 and the scribe line region 3, the auxiliary portions 7 disposed along the seal rings 6 are intermittently arranged, and the seal rings 6 are made of a metal layer. COPYRIGHT: (C)2007,JPO&INPIT
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