| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermoelectric module that can reduce stress put to a thermoelectric element when attaching the thermoelectric module or joining it to a package. SOLUTION: A thermoelectric module has a primary insulating substrate 12, a secondary insulating substrate 11 that has an extended region elongated by a predetermined length compared to this primary insulating substrate 12 and is arranged opposed to the primary insulating substrate 12, multiple electrodes 14 and 15 formed on respective surfaces opposed to the primary and secondary insulating substrates 12 and 11, thermoelectric elements 13a and 13b located between respective electrodes, and metallized layers 18 and 19 formed on respective reverse surfaces of the primary insulating substrate 11 and the secondary insulating substrate 12, wherein the metallized layer 19's planar shape of the secondary insulating substrate 12 is the same as the metallized layer 18's planar shape of the primary insulating substrate 11. In the extended region L of the secondary insulating substrate 12, the metallized layer is formed occupying 0 to 30% of the area of the extended region L. COPYRIGHT: (C)2007,JPO&INPIT
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