| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board according to requirements of heat dissipation by improving heat radiation near a through hole to be provided so as to pierce a metal substrate, and a circuit apparatus using the same. SOLUTION: This circuit apparatus 50 in which a metal substrate 1 having openings 2 as a core member is provided in the inside of a circuit board 10 has protrusions 1a on the end of a top surface side of the openings 2 and rounded corner portions 1b on the end of the bottom surface side. Wiring patterns 4, 6 are formed on both surface sides of this metal substrate 1 via insulation layers 3, 5. Insulation layers 3a, 5a are each provided in the openings, and a joining surface CB thereof is deviated to the same side as that of the protrusions 1a rather than an intermediate position in a film thickness direction of the metal substrate 1. To electrically connect the wiring patterns, conductor layers 8 piercing the metal substrate 1 via the opening 2 and connecting the wiring pattern 4 to the wiring pattern 6 are formed, and conduction between the wiring patterns can be acquired. Further, a semiconductor chip 20 is directly connected on the top surface side of the circuit board 10 via solder balls 21. COPYRIGHT: (C)2007,JPO&INPIT
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