| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition capable of forming a resin layer retaining high adhesion to a ceramic substrate even at an elevated temperature. SOLUTION: The resin composition for forming a polyimide resin layer adjacent to the ceramic substrate contains a polyimide resin precursor and an organic solvent in which the polyimide resin precursor is dissolved. The polyimide resin precursor has a siloxane skeleton of formula (1) (wherein R<SP>1</SP>is a 1-5C alkylene group; R<SP>2</SP>is a 1-5C alkyl group; n is an integer of 1-10; and multiple R<SP>1</SP>'s and R<SP>2</SP>'s within the same molecule may be identical to or different from each other) and produces a polyimide resin through heating. COPYRIGHT: (C)2007,JPO&INPIT
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