发明名称 Polishing pad conditioning device e.g. diamond conditioning device, for e.g. chemically mechanical polishing device, has elastic part deformed with proximity of sharp end of part with polish pad to condition pad by scraping off pad surface
摘要 <p>The device (30) has a clamping section (32) for clamping a base end of a deformed or moved or elastic part (31). The elastic part is elastically deformed with contact of proximity of a sharp end of the elastic part with a polish pad (20), so that a pad conditioning of the pad by scraping off a surface of the pad is carried out by the proximity of the sharp end of the elastic part. The elastic part is pressed on against the surface of the polish pad with a preset pad cushioning pressure, where the part is a brush-like material that is made of stainless steel, duralumin and brass. Independent claims are also included for the following: (1) a polishing device including a pad conditioning device (2) a pad conditioning method for dressing a surface of a polish pad that is utilized in a polishing device for polishing a workpiece (3) a pad manufacturing method for conditioning a surface of a polish pad (4) a pad manufacturing device for conditioning a surface of a polish pad.</p>
申请公布号 DE102006040403(A1) 申请公布日期 2007.03.15
申请号 DE20061040403 申请日期 2006.08.29
申请人 TOKYO SEIMITSU CO. LTD. 发明人 FUJITA, TAKASHI
分类号 B24B53/00;B24B53/017 主分类号 B24B53/00
代理机构 代理人
主权项
地址