| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a cured film formable by low-temperature curing without harming the function of an organic semiconductor device, etc., and excellent in various properties such as resolution, electric insulation, thermal shock resistance and chemical resistance; and also to provide a method for producing the cured film, and a radiation sensitive resin composition capable of giving the cured film and suitable for an interlayer insulation film, a surface protective film, etc., of a semiconductor device. <P>SOLUTION: The radiation sensitive resin composition for forming an insulating film comprises an alkali-soluble resin (A) having a phenolic hydroxyl group, a radiation sensitive acid generator (B), a crosslinking agent (C), an adhesion assistant (D) and an organic solvent (E), and has a solid concentration of 7-25 mass%. <P>COPYRIGHT: (C)2007,JPO&INPIT |
