| 摘要 |
PROBLEM TO BE SOLVED: To prevent poor processing such as stripping of a wafer by protecting the end face of the wafer structurally. SOLUTION: Under a state where the non-processed surface S2 of a wafer W excepting a circle C at the processing portion is covered with a protective member 5 laminated on a disc-like member 3 through a lip packing 7, gas in a space sp formed by the disc-like member 3, the protective member 5, the processed surface S2 of the wafer W, and the lip packing 7 is discharged from an interconnection opening 9. Since the protective member 5 is sucked to the disc-like member 3, the wafer W does not touch the processing liquid excepting the circle C at the processing portion. Consequently, poor processing where the end face of the wafer W is processed with processing liquid or wax bonding the wafer W to a substrate is corroded with the processing liquid to cause stripping of the wafer W can be prevented. Furthermore, the wafer end face protective device 1 can be fixed to the wafer by simple operation for exhausting from the interconnection opening 9, and it can be removed by simply eliminating negative pressure in the space sp. COPYRIGHT: (C)2007,JPO&INPIT |
