| 摘要 |
PROBLEM TO BE SOLVED: To provide a film substrate which has excellent expandability and has excellent performances required for adhesive tapes for processing semiconductor wafers, such as the high recovery of adhesive tapes for processing semiconductor wafers, after expanded, and to provide an adhesive tape using the same and used for processing semiconductor wafers. SOLUTION: This film substrate used for adhesive tapes for processing semiconductor wafers is characterized in that the film substrate comprises a resin composition consisting mainly of a propylenic copolymer and has a tensile elastic modulus of 50 to 250 MPa. The adhesive tape for processing the semiconductor wafer is characterized by comprising the film substrate and an adhesive layer disposed one side of the film substrate. COPYRIGHT: (C)2007,JPO&INPIT |
