发明名称 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method and manufacturing apparatus of semiconductor devices improving the electrical characteristics of the semiconductor device using an organic semiconductor layer. SOLUTION: A manufacturing method of semiconductor devices is characterized by having: a first step for forming an organic semiconductor layer 20 by coating the water-repellent surface 30a of a stamp 30 having water repellency with a liquid containing an organic semiconductor material; a second step for crystallizing the organic semiconductor material forming the organic semiconductor layer 20 in the state in contact with the water-repellent surface 30a by drying the organic semiconductor layer 20; and a third step for transferring the organic semiconductor layer 20 to the surface 13a of a substrate 10 to be transferred by pressing the forming surface side of the organic semiconductor layer 20 in the stamp 30 to the surface 13a of the substrate 10 to be transferred. A manufacturing apparatus of semiconductor devices is also provided. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007067390(A) 申请公布日期 2007.03.15
申请号 JP20060211614 申请日期 2006.08.03
申请人 SONY CORP 发明人 NOMOTO AKIHIRO
分类号 H01L21/336;H01L29/786;H01L51/05;H01L51/40 主分类号 H01L21/336
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