发明名称 INSULATING SUBSTRATE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an insulating substrate for wiring which can be manufactured relatively simply with high precision and a perforated insulating substrate. SOLUTION: An assembling process A holds a plurality of metal wire materials 11 cut into a predetermined length perpendicularly to a glass pane, and arranges a glass 13 of an insulating raw material cut into a predetermined profile in contact with a base jig 14 of predetermined profile. A heating process B passes an assembly through a heating furnace, pressurizes the metal wire materials 11 to the softened glass 13, and embedded. A pressurizing method makes the plurality of the metal wire materials 11 held perpendicularly with this weight jig 15, and gravity pressurized. In an integrated plywood which the metal wire materials 11 is implanted on the glass 13, each jig is disassembled at decomposing step C, after annealing, and the integrated plywood 17 is separated. Then, the metal wire material 11 is cut at a polishing process D, and the glass front surface is polished and processed so that the front surface of the integrated plywood 17 may be made to expose the end surface. In a finishing process E, the integrated plywood 17 is processed by polishing and cleaning, and becomes an insulating substrate 10. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007067387(A) 申请公布日期 2007.03.15
申请号 JP20060210693 申请日期 2006.08.02
申请人 NEC SCHOTT COMPONENTS CORP;SANSET KOGYO KK 发明人 KAMATA HIROSHI;ANZAI MASAMI
分类号 H01L23/15;H01L23/14 主分类号 H01L23/15
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